IEEE 2025 8th International Conference on Advanced Electronic Materials, Computers and Software Engineering (AEMCSE 2025)
About & call for papers
IEEE 2025 8th International Conference on Advanced Electronic Materials, Computers and Software Engineering (AEMCSE 2025) will be grandly held in Nanjing, China, from May 9-11, 2025. Conference Website: https://ais.cn/u/quuEfy ---Call For Papers--- The topi… Read more
IEEE 2025 8th International Conference on Advanced Electronic Materials, Computers and Software Engineering (AEMCSE 2025) will be grandly held in Nanjing, China, from May 9-11, 2025. Conference Website: https://ais.cn/u/quuEfy ---Call For Papers--- The topics of interest for submission include, but are not limited to: 1.Advanced Electronic Materials - Nanomaterials and Nanotechnology - Semiconductor Materials and Devices - Electronic Packaging and Interconnection Technology - Flexible electronics and smart wearable devices - High Frequency Electronic Materials and Applications ...... 2.Computers Engineering - Artificial Intelligence and Machine Learning - Edge Computing and Internet of Things (IoT) - High-Performance Computing and Parallel Computing - Computer Vision and Image Processing - Computer Networking and Communications ...... 3.Software Engineering - Software Architecture and Design - Software Testing and Quality Assurance - Continuous Integration and Continuous Deployment - Software Architecture and Design Patterns - Cloud Computing and Service-oriented Architecture ...... ---Publication--- All papers, both invited and contributed, will be reviewed by two or three experts from the committees. After a careful reviewing process, all accepted full papers will be published by IEEE(ISBN:979-8-3315-1091-6), and submitted to IEEE Xplore, EI Compendex and Scopus for indexing. ---Important Dates--- Full Paper Submission Date: April 8, 2025 Final Paper Submission Date: April 25, 2025 Registration Deadline: April 30, 2025 Conference Dates: May 9-11, 2025 --- Paper Submission--- Please send the full paper(word+pdf) to Submission System: https://ais.cn/u/quuEfy
Venue
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