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6th International Conference on Circuits, Systems and Devices (ICCSD 2026)

Part of the International Conference on Circuits, Systems and Devices (ICCSD) series →Recurring

Dates13–15 Nov 2026
LocationNingbo, China
SubmissionsNot listed
RegistrationNot listed
FormatHybrid
FieldEngineering & Technology · Electrical & Electronic Engineering
OrganizerNot listed

About & call for papers

[ Proceedings ] After a careful reviewing process, all accepted papers after proper registration and presentation, will be published by IEEE Conference Proceedings, which will be included in IEEE Xplore, and submitted for indexing of Ei Compendex & Scopus afte… Read more

[ Proceedings ] After a careful reviewing process, all accepted papers after proper registration and presentation, will be published by IEEE Conference Proceedings, which will be included in IEEE Xplore, and submitted for indexing of Ei Compendex & Scopus after conference. [ Call for Papers ] Track 1: Microelectronic Devices Advanced Transistors(GAAFETs/ VSAFETs) Wide Bandgap Semiconductor Devices Quantum Devices Compound Semiconductor Devices Spintronic Devices Track 2: Power Devices and Power Management Insulated-Gate Bipolar Transistor (IGBT) Power MOSFET Silicon Carbide(SiC) Nano Energy Devices Energy Conversion Devices Energy Harvesting Technology DC-DC Converter Power Management & Energy Efficient Technology Track 3: Sensors and Displays Bio/Gas/Thermal/Voltage/Current Sensors Vision Intelligence & Image Sensors Acoustic Sensors Display Technology & Devices Photoelectric Conversion & Optical Fiber Sensing Track 4: Electromagnetics & Microwave Devices Power Amplifiers Mixer & Microwave Sources Terahertz Devices Magnetic Devices Electromagnetic Components Antenna Design Terahertz Sensing and Imaging Computational Electromagnetics Track 5: 3D Integration & Microsystems System in Package(SiP) Through Glass Via & Through Silicon Via 3D Integration Technology High Density Packaging CAD Tools for Packing Microelectromechanical Systems Photoelectric Fusion Module Chiplets Based Microsystems Wafer-Scale Integration & System on Wafer Track 6: Digital VLSI and Memory Systems Low-Power Digital Circuits Memory Devices and Circuit Design In-Memory Computing Architectures AI and Machine Learning Hardware SoC and 3D Heterogeneous Integration Hardware Security for VLSI Systems Emerging Post-CMOS Technologies VLSI Physical Design and EDA [ Submission ] Make a submission: https://www.zmeeting.org/submission/iccsd2026 [ Contact us ] Dr. Fidelia Lee E-mail: [email protected]

Venue

Science Hall Ningbo

266 Siyuan Road (opposite the east gate of Ningbo Bang Museum), Zhenhai District, Ningbo, China

Ningbo, China

Open Science Hall Ningbo in maps ↗

The address is as the organizer gave it, and it is not checked against a map.

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Frequently asked

When is the 6th International Conference on Circuits, Systems and Devices (ICCSD 2026) submission date?
The organizer has not published a submission date for this edition. One appears here as soon as they do.
Where is 6th International Conference on Circuits, Systems and Devices (ICCSD 2026) held?
At the Science Hall Ningbo, Ningbo, China, with remote attendance offered as well.
Can I attend 6th International Conference on Circuits, Systems and Devices (ICCSD 2026) remotely?
Yes — 6th International Conference on Circuits, Systems and Devices (ICCSD 2026) is hybrid, so remote attendance is offered alongside the venue.