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This edition has ended.7th International Conference on Circuits, Systems and Simulation (ICCSS 2024) was held 17–19 May 2024 in Kuala Lumpur. The information below is kept for reference.
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7th International Conference on Circuits, Systems and Simulation (ICCSS 2024)

Part of the International Conference on Circuits, Systems and Simulation (ICCSS) series →Recurring

Dates17–19 May 2024
LocationKuala Lumpur, Malaysia
SubmissionsNot listed
RegistrationClosed
FormatHybrid
FieldComputing & Data · Computer Science
OrganizerNot listed

About & call for papers

★ Publication★ Submitted papers will be sent to around 2-3 reviewers for peer review. After a rigorous reviewing process, submitted papers will be sent to around 2-3 reviewers for peer review. And accepted and presented papers after proper registration and pr… Read more

★ Publication★ Submitted papers will be sent to around 2-3 reviewers for peer review. After a rigorous reviewing process, submitted papers will be sent to around 2-3 reviewers for peer review. And accepted and presented papers after proper registration and presentation, will be published into open access Journal of Physics: Conference Series (JPCS), which submitted for Ei Compendex, Scopus, Thomson Reuters (WoS), Inspec index, et al. ★ Special Issue★ After conference, some selected papers, after content extention (at least 40%) and peer-review, will be recommended to be published in IEEE Transaction on Electron Devices as regular papers for free. The journal information is as follows. * ISSN: 0018-9383 * Impact Factor: 2.913 * Abstracted and indexed in: Science Citation Index, Science Citation Index Expanded, etc. ★ History★ * ICCSS 2023-Suzhou, China | May 17-19, 2023 | ISSN: 1742-6596 | Ei Compendex and Scopus * ICCSS 2022-Nanjing, China | May 13-15, 2022 | ISBN: 978-1-6654-8119-9 | Ei Compendex and Scopus * ICCSS 2021-Kuala Lumpur, Malaysia | May 26-28, 2021 | ISBN: 978-1-7281-6752-7 | Ei Compendex and Scopus * ICCSS 2019-Nanjing, China | June 13-15, 2019 | ISBN: 978-1-7281-3657-8 | Ei compendex and Scopus * ICCSS 2018-Guangzhou, China | July 14-16, 2018 | ISBN: 978-1-5386-7818-3 | Ei compendex and Scopus ★Call for papers★ Topics of interest for submission include, but are not limited to: Analog Circuits and Signal Processing Analytical and Stochastic Modeling Techniques and Applications Assembly and Packaging Automotive Circuits and Systems Biomedical Circuits and Systems Education in Circuits and Systems Electronic Design Automation Circuit Simulation & Modeling Computational Modeling and Simulation in Science and Engineering Computer Aided Network Design Design Automation Nonlinear Circuits and Systems Photonic and Optoelectronic Circuits Power and Energy Circuits Real-time Modeling and Simulation RF and Wireless Circuits and Systems Sensing and Sensor Networks Sensors and Interfaces More Topics, please visit at http://iccss.org/topic.html ★Submission★ 1. Full paper (publication and presentation) 2. Abstract (presentation only) Please submit your paper by Electronic Submission System. (https://www.zmeeting.org/submission/ICCSS2024) Send your enquiry to [email protected] More details about submission, please visit at http://iccss.org/sub.html ★★Contact Ms. Mirror Ding / Ms. (Conference Secretary) Email: [email protected]

Venue

Universiti Putra Malaysia

Universiti Putra Malaysia, 43400 UPM Serdang, Selangor Darul Ehsan, MALAYSIA

Kuala Lumpur, Malaysia

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Frequently asked

When is the 7th International Conference on Circuits, Systems and Simulation (ICCSS 2024) submission date?
This edition has ended. The series page shows whether a newer edition is accepting submissions.
Where was 7th International Conference on Circuits, Systems and Simulation (ICCSS 2024) held?
It was held at the Universiti Putra Malaysia, Kuala Lumpur, Malaysia, with remote attendance offered as well.
Can I attend 7th International Conference on Circuits, Systems and Simulation (ICCSS 2024) remotely?
Yes — 7th International Conference on Circuits, Systems and Simulation (ICCSS 2024) is hybrid, so remote attendance is offered alongside the venue.