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This edition has ended.7th International Conference on Engineering Materials (ICEM 2026) was held 24–26 Oct 2026 in Fukuoka. The information below is kept for reference.
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7th International Conference on Engineering Materials (ICEM 2026)

Part of the International Conference on Engineering Materials (ICEM) series →

Dates24–26 Oct 2026
LocationFukuoka, Japan
SubmissionsNot listed
RegistrationClosed
FormatHybrid
FieldPhysical Sciences · Materials Science
OrganizerNot listed

About & call for papers

Publication Papers submitted to the conference will be sent to reviewed by at least 2 indepentant reviewers, the accepted papers will be published into IET Conference Proceedings, which will be included in the IET Digital Library and IEEE Xplore, submitted to… Read more

Publication Papers submitted to the conference will be sent to reviewed by at least 2 indepentant reviewers, the accepted papers will be published into IET Conference Proceedings, which will be included in the IET Digital Library and IEEE Xplore, submitted to EI Compendex, Scopus, IET Inspec, Google Scholar, for indexing. Submission 1. Full paper(publication and presentation) 2. Abstract (presentation only) Submission Methods: https://confsys.iconf.org/submission/icem2026 E-mail: [email protected] More detail about submission, please visit https://www.icem.org/sub.html Contact Ms. Iris Tang Webtsite: www.icem.org Email: [email protected] Contact Number: +86-28-88220101

Venue

Fukuoka, Japan
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Frequently asked

When is the 7th International Conference on Engineering Materials (ICEM 2026) submission date?
This edition has ended. The series page shows whether a newer edition is accepting submissions.
Where was 7th International Conference on Engineering Materials (ICEM 2026) held?
It was held in Fukuoka, Japan, with remote attendance offered as well.
Can I attend 7th International Conference on Engineering Materials (ICEM 2026) remotely?
Yes — 7th International Conference on Engineering Materials (ICEM 2026) is hybrid, so remote attendance is offered alongside the venue.