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This edition has ended.10th International Conference on Integrated Circuits and Microsystems (ICICM 2025) was held 17–19 Oct 2025 in Hefei. The information below is kept for reference.
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10th International Conference on Integrated Circuits and Microsystems (ICICM 2025)

Part of the International Conference on Integrated Circuits and Microsystems(ICICM) series →Recurring

Dates17–19 Oct 2025
LocationHefei, China
SubmissionsNot listed
RegistrationClosed
FormatHybrid
FieldNot listed
OrganizerNot listed

About & call for papers

=Publication= The accepted and registered papers will be publication in Conference Proceedings, which will be indexed by EI Compendex, Scopus, etc. ***ICICM 2016-2024 has been successfully indexed by EI Compendex and Scopus already! ***Selected papers will be… Read more

=Publication= The accepted and registered papers will be publication in Conference Proceedings, which will be indexed by EI Compendex, Scopus, etc. ***ICICM 2016-2024 has been successfully indexed by EI Compendex and Scopus already! ***Selected papers will be recommended to JOURNAL OF ELECTRONICS & INFORMATION TECHNOLOGY (EI Compendex & ESCI indexing) ==Submission== 1. Full paper (publication and presentation) 2. Abstract (presentation only) ★ Electronic submission system: https://easychair.org/conferences/?conf=icicm2025 ★ Email submission: [email protected] More detail about submission, please visit at http://icicm.net/submission.html =Topics (include but not limit)= Track 1: Electronic Design Automation (EDA) • Progress of EDA algorithms • EDA for emerging technologies • Hardware-software co-design with EDA • EDA in High Performance Computing (HPC) • EDA in analog and mixed-signal design Track 2: Integrated Circuit and System Design • Digital, analog, mixed-signal IC and SOC design technology • IC computer-aided design technology, DFM • Modeling and simulation Track 3: Semiconductor Devices and Circuits • Components and circuits for wireless systems • Low power, RF devices and circuits • Silicon/Germanium Devices and Device Physics • Compound semiconductor devices and circuits Track 4: Process Technology and Manufacturing • Silicon integrated circuits and manufacturing • Interconnect, low-K, high-K and other process technologies • Packaging and testing technology, equipment technology For more topics, please visit at: http://icicm.net/call-for-papers.html ==Organizing Committee== Advisory Chairs Junfa Mao, Shenzhen University, China Yue Hao, Xidian University, China Conference Chairs Zhigong Wang, Southeast University, China Ning Xu, Wuhan University of Technology, China Conference Co-Chairs Yu Wang,Tsinghua University,China Letian Huang, University of Electronic Science and Technology of China, China Program Chairs Jiliang Zhang, Hunan University, China Ying Wang, Institute of Computing Technology, Chinese Academy of Sciences, China Sheng Chang, Wuhan University, China Yingmei Chen, Southeast University, China Xiulong Wu, Anhui University, China Zhikuang Cai, Nanjing University of Posts and Telecommunications, China Zhuo Zou, Fudan University, China Jianguo Hu, Sun Yat-sen University , China Bei Yu,The Chinese University of Hong Kong, China Program Co-Chairs Junyong Deng, Xi'an University of Posts & Telecommunications, China Jun Xu, Nanjing University, China Zhixiong Di, Southwest Jiaotong University, China Guojie Luo, Peking University, China Xiaojun Zhai, University of Essex, UK Wei Xing, The University of Sheffield, UK Program Committee Shi Pu, Wuhan University of Technology , China Haizhi Song, University Of Electronic Science And Technology Of China, China Lu Zhu, Sun Yat-sen University, China Youming Zhang, Southeast University, China Jianshi Tang, Tsinghua University, China Weiguang Sheng, Shanghai Jiao Tong University, China Hao Gao, Austria & Eindhoven University of Technology, The Netherland Yun Fang, Silicon Austria Labs, Austria Jeff Kilby, Auckland University of Technology, New Zealand Zhijun Zhou, Southeast University, China Xingyuan Tong, Xi`an University Of Posts & Telecommunications, China Wei Hu, Northwestern Polytechnical University, China Local Chair Bowen Jia, Wuhan University of Technology , China Student Program Chairs Keping Wang, Tianjin University, China Delong Shang, Institute of Microelectronics of the Chinese Academy of Sciences, China Fanyi Meng, Tianjin University, China Student Program Committee Li Du, Nanjing University, China Lei Wang, Nanjing University Of Posts And Telecommunications, China Xianbo Li, Sun Yat-sen University, China Tiehu Li, Chongqing University of Technology, China Moufu Kong, University of Electronic Science and Technology of China, China Jiaxin Liu, University of Electronic Science and Technology of China, China Maliang Liu, Xidian University, China More Organizing Committee list, please visit: https://icicm.net/committee.html =Contact us= Ms. Mila Xiao Email: [email protected] Web: http://icicm.net/ Tel: (86)134-0855-5552

Venue

Anhui University

Hefei, China

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Frequently asked

When is the 10th International Conference on Integrated Circuits and Microsystems (ICICM 2025) submission date?
This edition has ended. The series page shows whether a newer edition is accepting submissions.
Where was 10th International Conference on Integrated Circuits and Microsystems (ICICM 2025) held?
It was held at the Anhui University, Hefei, China, with remote attendance offered as well.
Can I attend 10th International Conference on Integrated Circuits and Microsystems (ICICM 2025) remotely?
Yes — 10th International Conference on Integrated Circuits and Microsystems (ICICM 2025) is hybrid, so remote attendance is offered alongside the venue.