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This edition has ended.10th International Conference on Mechanical and Electronics Engineering (ICMEE 2024) was held 27–29 Dec 2024 in Xi'an. The information below is kept for reference.
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10th International Conference on Mechanical and Electronics Engineering (ICMEE 2024)

Part of the International Conference on Mechanical and Electronics Engineering (ICMEE) series →Recurring

Dates27–29 Dec 2024
LocationXi'an, China
SubmissionsNot listed
RegistrationClosed
FormatHybrid
FieldEngineering & Technology · Mechanical Engineering
OrganizerNot listed

About & call for papers

*Proceedings* Submitted papers will be Peer-Reviewed (Double Blind) and the accepted papers will be collected in the conference proceedings. *Committee* Advisory Chairs Rongjun Ding, Hunan University, China Xiaohong Guan, Xi'an Jiaotong University, China Yang… Read more

*Proceedings* Submitted papers will be Peer-Reviewed (Double Blind) and the accepted papers will be collected in the conference proceedings. *Committee* Advisory Chairs Rongjun Ding, Hunan University, China Xiaohong Guan, Xi'an Jiaotong University, China Yang Shi, University of Victoria, Canada Conference Chairs Maode Yan, Changan University, China Shengjie Jiao, Changan University, China Song Gao, Xi'an Technological University, China Program Chairs Fei Hui, Changan University, China Yisheng An, Changan University, China Xuelin Lei, East China University of Science and Technology, China Junfeng Jing, Xi'an Polytechnic University, China Feng Zhao, Xi’an University of Posts & Telecommunications, China Program Co-Chairs Qingchang Lu, Changan University, China Zhigang Xu, Changan University, China Zhanwen Liu, Chang’an University, China Lei Zuo, Chang’an University, China Guowang Gao, Xi’an Shiyou University, China International Program Committees Ando Ryosuke, Toyota Institute, Japan Qiang Meng, National University of Singapore, Singapore Richard Bucknall, University College London, UK Ronghui Liu, University of Leeds, UK Ali Mosleh, University of California, USA Asad Khattak, University of Tennessee, USA Yinhai Wang, University of Washington, USA Student Program Chairs Xianwu Gong, Changan University, China Liang Dai, Changan University, China Kai Du, Changan University, China Li Li, Changan University, China Liya Zhu, Changan University, China Kenan Mu, Changan University, China Regional Chairs Libo Zhao, Xi'an Jiaotong University, China Hao Deng, Henan University, China Xiaoping Li, University of Electronic Science and Technology of China, China Wei Chen, Nanjing University of Science and Technology, China Daiyu Zhang, Jiangsu University of Science and Technology, China Peng Xiao, Sun Yat-sen University, China Yuanye Chen, North China Electric Power University, China Haiquan Wang, Zhongyuan University of Technology, China Publicity Committee Tongxing Zheng, Xi'an Jiaotong University, China Bin Li, Northwestern Polytechnical University, China Feihu Zhang, Northwestern Polytechnical University, China Huachao Dong, Northwestern Polytechnical University, China Shouxu Zhang, Northwestern Polytechnical University, China Zhuo Zhang, Northwestern Polytechnical University, China Bo Li, Northwestern Polytechnical University, China Chaowen Liu, Xi'an University of Posts & Telecommunications, China Wei Guo, Xidian University, China Xinpeng Fang, Xidian University, China *Topics* (included but not limited to) ●Acoustics and Noise Control Marine System Design ●Ballistics MEMS and Nano Technology ●CAD/CAM/CIM New and Renewable Energy ●CFD Noise and Vibration ●Composite and Smart Materials Noise Control ●HVAC Textile and Leather Technology ●Internal Combustion Engines Tribology ●Machinery and Machine Design Turbulence ●Electrical materials Electromagnetics ●High voltage techniques microwave ●Power electronics and applications antennas ●Mechatronics Communication theory and systems ●Control theory and applications Optoelectronics ●Robotics and automation systems Biomedical electronics ●Intelligent systems Sensors ●Electronics instrumentation For more topics, please visit: http://icmee.org/cfp.html *Submission Method* 1. Online Submission: http://confsys.iconf.org/submission/icmee2024 2. Send directly to: [email protected] *Contact Us* Secretary: Sara Wong Email: [email protected] Web: www.icmee.org Tel: 86-19136375767

Venue

Xi'an, China
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Frequently asked

When is the 10th International Conference on Mechanical and Electronics Engineering (ICMEE 2024) submission date?
This edition has ended. The series page shows whether a newer edition is accepting submissions.
Where was 10th International Conference on Mechanical and Electronics Engineering (ICMEE 2024) held?
It was held in Xi'an, China, with remote attendance offered as well.
Can I attend 10th International Conference on Mechanical and Electronics Engineering (ICMEE 2024) remotely?
Yes — 10th International Conference on Mechanical and Electronics Engineering (ICMEE 2024) is hybrid, so remote attendance is offered alongside the venue.