12th International Conference on Nano and Materials Science (ICNMS 2024)

Publication The accepted and presented papers will be included in ICNMS 2024 Conference Proceedings. The proceedings will be published by IEEE and archived in IEEE Xplore, and will be indexed by Ei Compendex and Scopus, etc. Publication History *ICNMS 2023 - IEEE Xplore [ISBN: 978-1-6654-8804-4] *ICNMS 2022 - Materials Science Forum Vol.1067 [ISBN: 978-3-0364-0133-1]-Ei Compendex & Scopus indexed *ICNMS 2021 - Key Engineering Materials Vol.891 [ISBN: 978-3-0357-1789-1]-Ei Compendex & Scopus indexed *ICNMS 2020 - IOP Conference Series: Materials Science and Engineering Vol. 842-Scopus indexed *ICNMS 2019 - American Institute of Physics)AIP Vol. 2083-Scopus indexed *ICNMS 2018 - American Institute of Physics)AIP Vol. 1957-Scopus indexed *ICNMS 2017 - Nano Hybirds and Composites (NHC)Vol. 16 *ICNMS 2016 - MATEC Vol. 43, 2016-Ei Compendex indexed Conference Committees *Conference Chairs Ramesh K. Agarwal (Fellow of IEEE, AAAS, AIAA, APS, ASME, CSAA, SME and ASEE), Washington University in St. Louis, USA Zhang Dao Hua (Fellow of SAEng, InstP, IET), Nanyang Technological University, Singapore Steven Y. Liang (Fellow of ASME & SME), Georgia Institute of Technology, USA *Program Committee Chairs Jing Wang, University of South Florida, USA Yong Suk Yang, Pusan National University, South Korea *Program Committee Co-Chairs Xu Chen, University of Washington, USA Jin-Soo Park, Sangmyung University, South Korea Kreangkrai Maneeintr, Chulalongkorn University, Thailand *Publication Chair Lichen Kang, Southwest Jiaotong University, China Speakers *Prof. Ramesh K. Agarwal (Fellow of IEEE, AAAS, AIAA, APS, ASME, CSAA, SME and ASEE) William Palm Professor of Engineering Washington University in St. Louis, USA *Prof. Daohua Zhang (Fellow of SAEng, InstP, IET) Nanyang Technological University, Singapore *Prof. Jae-Jin Shim Yeungnam University, South Korea *Prof. Anja Pfennig HTW-Berlin University of Applied Sciences, Germany *Assoc. Prof. Basil TungLiong Wong Swinburne University of Technology, Malaysia Submission * Submission System: http://confsys.iconf.org/submission/icnms2024 * Email box: [email protected] Note: Full Paper is for Oral Presentation and Publication, while Abstract is only for Oral Presentation. --For more submission guidline, you can learn through: http://www.icnms.org/submission.html Conference Topics * Materials behavior * Casting and solidification * Powder metallurgy and ceramic forming * Surface, subsurface, and interface phenomena * Coatings and surface engineering * Nanomaterials and nanomanufacturing * Biomedical manufacturing * Environmentally sustainable manufacturing processes and systems --Please check the link which you can find more topics: http://www.icnms.org/cfp.html Contact Us Conference Secretary: Ms. Evelyn Cheung Email: [email protected]