10th International Conference on Smart Materials Applications (ICSMA 2027)

Conference Proceeding All submissions will be peer reviewed, the registered and presented papers will be published into Conference Proceedings, Indexed by Elsevier: SCOPUS. Committees Conference Committee Chairs Prof. Kazuo Umemura, Tokyo University of Science, Japan Prof. Jong Hak Kim, Yonsei University, South Korea Prof. Xiaohong Zhu, Sichuan University, China Program Committee Chairs Assoc. Prof. Jung Tae Park, Yonsei University, South Korea Assoc. Prof. Teik-Cheng Lim, Singapore University of Social Sciences, Singapore Dr. Seok-Keun Koh, C&G Hitech Co., Ltd, Korea Call for Papers (01) Smart & Functional Materials (02) Material Properties & Characterization (03) Manufacturing & Processing (04) Computational & AI-Driven Approaches (05) Applications & Sustainability For more topics, please visit: https://www.icsma.org/cfp.html Submission Please upload your abstract/full paper to iconf. Submission System (http://confsys.iconf.org/submission/icsma2027). Any questions, please feel free to contact via [email protected]. 1. Full Paper (Presentation and Publication) Accepted full paper will be invited to give the oral presentation at the conference and be published in the conference proceeding. 2. Abstract (Presentation only) Accepted abstract will be invited to give the presentation at the conference, the presentation will not be published. For more details, please visit: https://www.icsma.org/submission.html Contact Us Ms. Sia Fan Email: [email protected] Tel: +852-36789835 (Hong Kong) / +86-15008402564 (China)