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This edition has ended.7th International Conference on Materials Design and Applications (ICMDA 2024) was held 9–12 Apr 2024 in Tokyo. The information below is kept for reference.
The 2027 edition is now open →

7th International Conference on Materials Design and Applications (ICMDA 2024)

Part of the International Conference on Materials Design and Applications (ICMDA) series →Recurring

Dates9–12 Apr 2024
LocationTokyo, Japan
SubmissionsNot listed
RegistrationClosed
FormatHybrid
FieldNot listed
OrganizerNot listed

About & call for papers

* Publication Accepted and registered papers with presentation will be published in below listed journals of Scientific.Net collection. Defect and Diffusion Forum (DDF) (ISSN print 1012-0386 / ISSN web 1662-9507) Solid State Phenomena (SSP) (ISSN print 1012-03… Read more

* Publication Accepted and registered papers with presentation will be published in below listed journals of Scientific.Net collection. Defect and Diffusion Forum (DDF) (ISSN print 1012-0386 / ISSN web 1662-9507) Solid State Phenomena (SSP) (ISSN print 1012-0394 / ISSN web 1662-9779) Materials Science Forum (MSF) (ISSN print 0255-5476 / ISSN web 1662-9752) Key Engineering Materials (KEM) (ISSN print 1013-9826 / ISSN web 1662-9795) Papers will be sent for indexing by Scopus, Inspec, Chemical Abstracts Service, Google Scholar etc. * History ICMDA 2022: Vol. 931. Key Engineering Materials-ISBN: 978-3-0357-2847-7-Online Linkage | Indexed by Scopus ICMDA 2021: Vol. 324. Solid State Phenomena-ISBN: 978-3-0357-1859-1-Online Linkage | Indexed by Ei Compendex & Scopus ICMDA 2020: Vol. 1009, Materials Science Forum-ISBN: 978-3-0357-1688-7-Online Linkage | Indexed by Ei Compendex & Scopus ICMDA 2019: Vol. 972, Materials Science Forum-ISBN: 978-3-0357-1530-9-Online Linkage | Indexed by Ei Compendex & Scopus ICMDA 2018: Vol. 937, Materials Science Forum-ISBN: 978-3-0357-1377-0-Online Linkage | Indexed by Ei Compendex & Scopus * Submission Method System Submission: http://confsys.iconf.org/submission/icmda2024 Email Submission: [email protected] For more details, you can learn through: http://www.icmda.org/sub.html * Call for Paper -Materials Properties, Measuring Methods and Applications Fracture Mechanics Mechanical Properties Electrical Properties -Materials Science and Materials Processing Technology Biological Material Chemical Materials Smart Materials and Intelligent Systems -Materials Analyses and Modeling Metallography Computational Material Science Numerical Techniques For more topics, please visit: http://www.icmda.org/cfp.html * Contact Us Conference Secretary: Ms. Alyson Li Email: [email protected] Tel: +1-669-900-4528/+86-28-87577778 Working Time: Monday - Friday; 9:30-18:00 (UTC/GMT+08:00)

Venue

TOKYO INSTITUTE OF TECHNOLOGY, JAPAN

2-12-1 Ookayama, Meguro-ku, Tokyo 152-8550 Japan

Tokyo, Japan

Open TOKYO INSTITUTE OF TECHNOLOGY, JAPAN in maps ↗

The address is as the organizer gave it, and it is not checked against a map.

Frequently asked

When is the 7th International Conference on Materials Design and Applications (ICMDA 2024) submission date?
This edition has ended. The series page shows whether a newer edition is accepting submissions.
Where was 7th International Conference on Materials Design and Applications (ICMDA 2024) held?
It was held at the TOKYO INSTITUTE OF TECHNOLOGY, JAPAN, Tokyo, Japan, with remote attendance offered as well.
Can I attend 7th International Conference on Materials Design and Applications (ICMDA 2024) remotely?
Yes — 7th International Conference on Materials Design and Applications (ICMDA 2024) is hybrid, so remote attendance is offered alongside the venue.