9th International Conference on Materials Design and Applications (ICMDA 2026)

2026 9th International Conference on Materials Design and Applications (ICMDA 2026) will be held in Tohoku University, Sendai, Japan during April 17-20, 2026. ICMDA focus on fundamental research and application areas in the field of the design and application of engineering materials, predominantly within the context of mechanical engineering applications such as automobile, railway, marine, aerospace, biomedical, pressure vessel technology, turbine technology, etc. This includes a wide range of materials engineering and technology, including metals, e.g., lightweight metallic materials, polymers, composites, and ceramics. Advanced applications would include manufacturing in the new or newer materials, testing methods, multi-scale experimental and computational aspects (e.g. micro- and nano-scale techniques). * Publication Accepted and registered papers with presentation will be published in below listed journals of Scientific.Net collection. Defect and Diffusion Forum (DDF) (ISSN print 1012-0386 / ISSN web 1662-9507) Solid State Phenomena (SSP) (ISSN print 1012-0394 / ISSN web 1662-9779) Materials Science Forum (MSF) (ISSN print 0255-5476 / ISSN web 1662-9752) Key Engineering Materials (KEM) (ISSN print 1013-9826 / ISSN web 1662-9795) Papers will be sent for indexing by Scopus, Inspec, Chemical Abstracts Service, Google Scholar etc. * History ICMDA 2024: Vol. 1128. Materials Science Forum-ISBN: 978-3-0364-0681-7-Online Linkage | Indexed by Scopus ICMDA 2023: Vol. 1099. Materials Science Forum-ISBN: 978-3-0364-0438-7-Online Linkage | Indexed by Scopus ICMDA 2022: Vol. 931. Key Engineering Materials-ISBN: 978-3-0357-2847-7-Online Linkage | Indexed by Scopus ICMDA 2021: Vol. 324. Solid State Phenomena-ISBN: 978-3-0357-1859-1-Online Linkage | Indexed by Ei Compendex & Scopus ICMDA 2020: Vol. 1009, Materials Science Forum-ISBN: 978-3-0357-1688-7-Online Linkage | Indexed by Ei Compendex & Scopus ICMDA 2019: Vol. 972, Materials Science Forum-ISBN: 978-3-0357-1530-9-Online Linkage | Indexed by Ei Compendex & Scopus ICMDA 2018: Vol. 937, Materials Science Forum-ISBN: 978-3-0357-1377-0-Online Linkage | Indexed by Ei Compendex & Scopus * Conference Committee Conference Chairs: Osamu Tabata, Kyoto University of Advanced Science, Japan Takashige Omatsu, Chiba University, Japan Program Chairs: Masahiro Nomura, The University of Tokyo, Japan Kwang Leong Choy, Duke Kunshan University, China Program Co-Chairs: Yoshio Kobayashi, Ibaraki University, Japan Anatoly Zinchenko, Nagoya University, Japan ...... More info about conference Committees: https://icmda.org/com.html * Submission Method System Submission: https://confsys.iconf.org/submission/icmda2026 Email Submission: [email protected] For more details, you can learn through: https://icmda.org/sub.html * Call for Paper -Materials Properties, Measuring Methods and Applications Creep-resistance Fracture Mechanics Mechanical Propertie -Materials Analyses and Modeling Electron Microscopy Artificial Intelligence Methods Computational Material Science -Materials Science and Materials Processing Technology Optical / Electrical / Magnetic Materials Environmental-Friendly Materials Surface Engineering / Coatings Technology For more topics, please visit: http://www.icmda.org/cfp.html * Contact Us Conference Secretary: Ms. Lynn Email: [email protected] Tel: +852-3155-4897/+86-28-87577778 Working Time: Monday - Friday; 9:30-18:00 (UTC/GMT+08:00)